パッケージングエンジニア/packaging engineer:外資系大手半導体メーカー (1,000-1,600万円) in 東京都

posted
job type
正社員
salary
¥ 10,000,000 年棒
apply now

job details

posted
location
東京都
job category
電気・電子・半導体
job type
正社員
salary
¥ 10,000,000 年棒
reference number
54108-13
apply now

job description

社名
社名非公開

職種
電気・半導体

業務内容

Key Responsibilities:



  1. Understand the requests and questions from customer and provide clear explanation with data to settle customer’s concerns.

  2. Provide company’s best solution to customer and guide them to choose the optimum package types which will fit design and application needs.

  3. Get customer approval and agreement by Trouble shooting and providing explanation with FTA and Engineering DOE data which provided by Package & Assembly engineering teams.

  4. Keep contact and Provide updated technology roadmap of Materials, Machines and Subcons information in Japan to company's Package & Assembly Team.

  5. Contact suppliers to resolve any material issues and being contact window for further update.

  6. Review TRB questions and provide the answers for PCN.


 


Experiences:



  • Around 10 years of semiconductor Package and Assembly experience

  • Experience of Wirebond/Mold/WLCSP related Engineering preferred

  • Experience of resolving Assembly and Packaging issues


 


Competences:



  • Good in English Speaking/Writing communication Skills

  • Good in English Presentation Skills

  • MS Office (Powerpoint, Excel, Word) user skills

  • Knowledge in FMEA, 8D, SPC, DOE



求められる経験
Experiences:
•Around 10 years of semiconductor Package and Assembly experience
•Experience of Wirebond/Mold/WLCSP related Engineering preferred
•Experience of resolving Assembly and Packaging issues


語学力
日本語/英語

給与
年収1000 ~ 1600万円