senior r&d engineer (bga, wafer bump) x2.

• Monitor performance throughout production cycle by following specification.
• Using statistical method (SPC, six sigma) to ensure process control and monitoring.
• Perform process matric (Design of Experiments and ANOVA) to investigate problems and support process improvements.
• Initiate continuous quality improvement plans.
• Interact with production, equipment engineering, and quality assurance team to address customer feedback and quality issues.
• Strictly and consistently comply with NPI and Operations procedures
• Liase with internal and external stakeholders

Job Requirements

• At least 5 years experience in Semiconductor (Packaging) Industry
• Back-End, with special focus on BGA, Bumping processes
• Good knowledge of Physics, Chemistry and Material Science
• Knowledge on physical characterization
• Knowledge of Design of Experiments (DOE)

If you are interested in the position, kindly send your CVs to sean.ho(@)randstad.com.sg

Please include your availability, expected salary and reason for leaving your current job.

We regret that only shortlisted candidates will be contacted. Applicants must be fully vaccinated or have a valid exemption in accordance with MOM’s regulations to allow them to enter the workplace. Applicants may be required to share verifiable COVID-19 vaccination documents or proof of a valid exemption at the point of offer. Randstad Pte. Limited and/or the Client reserves the right to withdraw an offer if the applicant fails to provide verifiable COVID-19 vaccination and/or proof of exemption documents.