summary

kuala lumpur, wilayah persekutuan
RM5,000 - RM15,000 per month
permanent
full-time

job category
manufacturing & production

job details

We are partnering with a Fortune 500 powerhouse that designs and manufactures the foundational chips powering nearly every modern technology from autonomous vehicles to industrial automation.

As they execute a multi-billion dollar expansion of their world-class Assembly & Test operations in Malaysia, we are looking for a high-calibre Equipment Engineer / Staff Engineer to take technical ownership of advanced Wirebond platforms.

Based in Malaysia. ...

Job Responsibilities:

Assess, select, and procure manufacturing equipment, focusing on cost-effectiveness and suitability for product manufacturing.
Manage the installation, modification, upgrades, and ongoing maintenance of all production equipment.
Stay informed on technical updates, safety alerts, and upgrades from equipment manufacturers.
Analyse equipment performance and reliability metrics.
Develop and implement strategies and solutions to boost equipment uptime and resolve issues impacting the manufacturing process.
Offer specialised technical assistance to the process engineering and equipment repair teams.
Document and define preventative maintenance schedules.

Qualifications

Bachelor degree of Electronics or Electrical Engineering, Mechanical Engineering, or related engineering degree.
Minimum 3 years as Wire bond Equipment Engineer with KNS and ASM wire bond equipment maintenance experience in semiconductor manufacturing operations.
Equipped with Wire bond process experiences will be added advantage.

Preferred Qualifications

Equipment experience with Wire bond process, must be able to hand on KNS and ASM wire bond machine
Prior experience with Gold/Cu/PCC wire & Bump ball process bonding
Equipment experience on other equipment post wire bond process (e.g., plasma, Die coat)
Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
Working knowledge of semiconductor manufacturing, and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviours.
Strong verbal and written communication skills
Demonstrated strong analytical, critical thinking and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationships

We are partnering with a Fortune 500 powerhouse that designs and manufactures the foundational chips powering nearly every modern technology from autonomous vehicles to industrial automation.

Based in Malaysia.
...

Job Responsibilities:

Assess, select, and procure manufacturing equipment, focusing on cost-effectiveness and suitability for product manufacturing.
Manage the installation, modification, upgrades, and ongoing maintenance of all production equipment.
Stay informed on technical updates, safety alerts, and upgrades from equipment manufacturers.
Analyse equipment performance and reliability metrics.
Develop and implement strategies and solutions to boost equipment uptime and resolve issues impacting the manufacturing process.
Offer specialised technical assistance to the process engineering and equipment repair teams.
Document and define preventative maintenance schedules.

Qualifications

Bachelor degree of Electronics or Electrical Engineering, Mechanical Engineering, or related engineering degree.
Minimum 3 years as Wire bond Equipment Engineer with KNS and ASM wire bond equipment maintenance experience in semiconductor manufacturing operations.
Equipped with Wire bond process experiences will be added advantage.

Preferred Qualifications

Equipment experience with Wire bond process, must be able to hand on KNS and ASM wire bond machine
Prior experience with Gold/Cu/PCC wire & Bump ball process bonding
Equipment experience on other equipment post wire bond process (e.g., plasma, Die coat)
Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
Working knowledge of semiconductor manufacturing, and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviours.
Strong verbal and written communication skills
Demonstrated strong analytical, critical thinking and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationships

skills
no additional skills required
qualifications
no additional qualifications required
education
Bachelor Degree

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process engineer [medical device]
- kuala lumpur, wilayah persekutuan
- permanent
- RM4,000 - RM8,000 per month
We are currently looking for a Process Engineer for a leading player in the Medical Device Manufacturing Industry for their expansion. This company has a legacy of more than 80 years in the world. This position requires your urgent attention.Based in Selangor or Perak (based on where you are currently based at)Expansion roleAttractive remuneration packagethe roleProcess Design & Optimization: Analyze existing production sequences to develop recommendations
posted 19 january 2026
We are currently looking for a Process Engineer for a leading player in the Medical Device Manufacturing Industry for their expansion. This company has a legacy of more than 80 years in the world. This position requires your urgent attention.Based in Selangor or Perak (based on where you are currently based at)Expansion roleAttractive remuneration packagethe roleProcess Design & Optimization: Analyze existing production sequences to develop recommendations
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equipment engineer / staff engineer (wirebond).

job details

skills

qualifications

education

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the application process.

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we'll give you a call.

getting you registered.

compliance check.

reference and background check.

the perfect job for you.

the interview.

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process engineer [medical device]

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