软素质要求:自我驱动力极强,具备优秀的跨团队沟通与资源协调能力;有 3 人以上算法或数据团队的 Tech Lead 经验,能够为团队指明技术演进方向。
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about the company:-华南知名半导体制造与芯片研发高新技术企业,聚焦功率半导体及特色工艺技术路线。about the team:-团队兼具IT技术视野与半导体制造业务基因,是连接芯片研发与自动化制造的核心桥梁。responsibilities:-深入调研芯片研发作业场景与痛点,统筹规划并推进公司研发领域数字化整体方案建设与全流程项目落地。-主导研发设计与仿真核心 EDA/TCAD 工具链的 IT 架构规划,协同团队完成软件选型、供应商交付管理及后续稳定运维。-持续优化研发工艺开发流程,贯通研发工程到制造工艺(R2M)的跨系统数据链路,确保数据一致性与高效集成。-独立完成需求梳理、系统原型设计与方案绘制,跟进开发、测试与上线全周期,保障项目实际效果落地。skills and Experience Required:-统招本科及以上学历,8 年及以上企业数字化/信息化建设经验,具备 3 年及以上半导体行业研发数字化经验者优先。-熟悉半导体研发、工艺开发及仿真基础业务逻辑,了解研发到制造的数据协同
about the company:-华南知名半导体制造与芯片研发高新技术企业,聚焦功率半导体及特色工艺技术路线。about the team:-团队兼具IT技术视野与半导体制造业务基因,是连接芯片研发与自动化制造的核心桥梁。responsibilities:-深入调研芯片研发作业场景与痛点,统筹规划并推进公司研发领域数字化整体方案建设与全流程项目落地。-主导研发设计与仿真核心 EDA/TCAD 工具链的 IT 架构规划,协同团队完成软件选型、供应商交付管理及后续稳定运维。-持续优化研发工艺开发流程,贯通研发工程到制造工艺(R2M)的跨系统数据链路,确保数据一致性与高效集成。-独立完成需求梳理、系统原型设计与方案绘制,跟进开发、测试与上线全周期,保障项目实际效果落地。skills and Experience Required:-统招本科及以上学历,8 年及以上企业数字化/信息化建设经验,具备 3 年及以上半导体行业研发数字化经验者优先。-熟悉半导体研发、工艺开发及仿真基础业务逻辑,了解研发到制造的数据协同