¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die s
社名社名非公開職種製品開発エンジニア業務内容Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die s
社名社名非公開職種製品開発エンジニア業務内容LED module development for Headlamp as R&D in Platform.He or She is responsible Optical design for LED module,negotiation to intenal (include VLS) &Customer【部署の仕事概要】自動車用次世代ライティング商品の光学設計【職務内容】ヘッドランプLED moduleの開発。LED Module Design,およびGLOBAL関連会社を含む社内および社外との均衡を行う求められる経験Master or Bachelor: Faculty of Engineering, Excel, Power Point, Japanese communication mandatoryExperience preferred optical engineer【必須】理工学系の大卒、または同等の基礎知識がある方日本語及び英語で会話、メー
社名社名非公開職種製品開発エンジニア業務内容LED module development for Headlamp as R&D in Platform.He or She is responsible Optical design for LED module,negotiation to intenal (include VLS) &Customer【部署の仕事概要】自動車用次世代ライティング商品の光学設計【職務内容】ヘッドランプLED moduleの開発。LED Module Design,およびGLOBAL関連会社を含む社内および社外との均衡を行う求められる経験Master or Bachelor: Faculty of Engineering, Excel, Power Point, Japanese communication mandatoryExperience preferred optical engineer【必須】理工学系の大卒、または同等の基礎知識がある方日本語及び英語で会話、メー
¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容1. Packaging design for high power semiconductor laser devices.2. Development and optimization of high thermal conductivity bonding process.3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling.4. Thermal and stress design of multi-channel lasers.5. Test and verification of components performance and reliability.求められる経験1. Bachelor’s degree and above.2. Deep understanding of GaAs-b
社名社名非公開職種製品開発エンジニア業務内容1. Packaging design for high power semiconductor laser devices.2. Development and optimization of high thermal conductivity bonding process.3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling.4. Thermal and stress design of multi-channel lasers.5. Test and verification of components performance and reliability.求められる経験1. Bachelor’s degree and above.2. Deep understanding of GaAs-b