¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容1. Packaging design for high power semiconductor laser devices.2. Development and optimization of high thermal conductivity bonding process.3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling.4. Thermal and stress design of multi-channel lasers.5. Test and verification of components performance and reliability.求められる経験1. Bachelor’s degree and above.2. Deep understanding of GaAs-b
社名社名非公開職種製品開発エンジニア業務内容1. Packaging design for high power semiconductor laser devices.2. Development and optimization of high thermal conductivity bonding process.3. Design and simulation of beam shaping system for high-power semiconductor lasers and the optical coupling.4. Thermal and stress design of multi-channel lasers.5. Test and verification of components performance and reliability.求められる経験1. Bachelor’s degree and above.2. Deep understanding of GaAs-b