¥8,000,000 - ¥20,000,000 per year, 年収800 ~ 2,000万円
社名社名非公開職種製品開発エンジニア業務内容Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die s
社名社名非公開職種製品開発エンジニア業務内容Focusing on the 3D die stacking technology developing and research. It is more desirable to have deep experience in both micro bump interconnection technologies of using pre applied underfill NCF (Non-Conductive-Film) and post applying one includng fluxing. Thermal compression bonding skill is mandatory. At least 40 um bump pitch technical experience is required, 20um bump pitch is desirable at the research level. 1. Leading 3D die s